How to Get Involved
Companies, Universities & Research Institutes Interested in Integrated Photonics are Encouraged to Participate
The IPSR-I is a living document that is continuously updated. The chapters need enrichment with technological, module and application developments in their respective fields. A call is always open for contributions by experts in the various technological and applicational fields to update the IPSR-I. The Integrated Photonic Systems Roadmap International (IPSR-I) invites all organizations, including universities, research institutes, SMEs, customers and the vertical supply chain to participate.
Participation and attendance at all IPSR-I meetings is by invitation, but all stakeholders who are willing to devote time and effort to achieve the goals of IPSR-I are encouraged to participate.
There are two ways to participate:
1. Join one of the working groups. List of WG's and WGL below. sent an e-mail to p.vanarkel@berenschot.nl and cwjames@mit.edu
2. Attend IPSR-I workshops by registering on the IPSR-I website and requesting an invitation to the meeting
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Working Groups |
Topics |
Co chair |
Co chair |
Co chair |
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Data/Tele IcT |
Data Center/Telecom |
Michael Robertson (Huawei) |
Michael Lebby (Lightwave Logic) |
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Sensors |
IoT & Industrial equipment |
Christophe Py (CNRC) |
Rich Grzybowski (Macom) |
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Automotive |
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Aerospace |
Rolf Evenbleij (Technobis) |
Amin Abassi (Antwerpspace) |
David Mackey (MBryonics) |
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Healthcare |
Thierry Robin (Thematys) |
Anu Agarwal (MIT) |
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Photonic Modules |
RF Photonics |
Arthur Paolella (Harris) |
Guillermo Carpintero (University Carlos III of Madrid) |
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Integrated Photonic Sensors |
Ben Miller (U of Rochester) |
Anu Agarwal (MIT) |
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IPSR Cost Emulators |
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Randolph Kirchain (MIT) |
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Electronic Photonic Design Automation |
Twan Korthorst (Synopsis / Phoenix) |
Tom Daspit (Mentor) |
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Front-end |
Monolithic Silicon Integration |
Abdul Rahim / Roel Baets (ePixfab) |
Lionel Kimerling (MIT) |
Ajey Jacob |
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InP & III-V compounds |
Mike Wale (TU/e) |
Gloria Hoefler (Infinera) |
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SiN |
Sami Musa (Vision & actions) |
Lionel Kimerling (MIT) |
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Polymers |
Felix Betschon (Vario optics) |
Michael Lebby (Lightwave Logic) |
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Back-end |
Packaging |
Peter 'O Brien (Tyndall) |
Bill Bottoms (3MTS) |
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Interconnects |
Peter Maat (Astron) |
Terry Smith |
John MacWilliams |
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Assembly |
Paul van Dijk (LioniX-International) |
Yi Quan (MRSI Systems) |
Dick Otte (Promex Industries) |
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Testing |
Sylwester Latkowski (TU/e) |
Dave Armstrong (Advantest) |
Tom Brown (U of Rochester) |