Roadmap Webinar Series: Board Level Optical Interconnect
Thursday, October 20, 2016 - 3:30pm
3:30-4:30 EDT
Abstract
Photonic solutions have been deployed within the interconnection hierarchy in telecommunication networks, in computing 
systems, and now at the board/backplane level in distributed data center architectures. An industrial consortium is being organized to evaluate systems specifications and scalable hardware solutions to support high-volume production of on-board interconnection.
systems, and now at the board/backplane level in distributed data center architectures. An industrial consortium is being organized to evaluate systems specifications and scalable hardware solutions to support high-volume production of on-board interconnection.Pervasive deployment of mid-board optical interconnect can potentially solve face place bandwidth density and energy/bit challenges, and support highly parallel architectures by elimination of the backplane. This presentation introduces the challenges of manufacturing hardware solutions at a competitive cost point. The drives is a single mode, expanded-beam module to be prototyped over the next 18 months. The applications are mid-board transceiver modules, 10 ports, disaggregated servers. The project is designed to determine manufacturability and scalable cost reduction.
Speakers
Terry Smith, 3M (top)
John MacWilliams, US Competitors
Registration
To register for this online event:
1. Go to https://mit.webex.com/mit/onstage/g.php?MTID=eb188241c7484941fb2373c9c55d2c217
2. Click "Register."
3. Enter registration password: mphcmit
4. On the registration form, enter your information and then click "Submit".
Once the host approves your registration, you will receive a confirmation email message with instructions on how to join the event.
For Assistance
Julie Diop, MIT
Upcoming Webinar
11/17 Key Challenges Identified by the Integrated Photonic Systems Roadmap, Lionel C. Kimerling, MIT
