Roadmap Overview

As a collaborative effort between iNEMI and the MIT Microphotonics Center, the IPSR Roadmap draws synergy from these two organizations’ histories of success in coordinating technology vision, developing new technology and implementing effective manufacturing. IPSR will integrate, and expand upon, the roadmapping efforts of both partners to address the systems as well as manufacturing needs of integrated photonics.

The roadmap is developed by eight coordinated Technology Working Groups (TWGs). These TWGs are similar to existing iNEMI and Microphotonics Center TWGs and inlcude many members from existing iNEMI-MIT groups; however, they differ in scope and their charters are more tightly focused.

The PEGs and TWGs meet independently plus hold two joint workshops where each group presents its work to the other stakeholders.  These meetings are designed to bring together the fragmented, customization-focused photonics industry to engage collaboratively in developing a common roadmap. 

All stakeholder organizations are welcomed to participate as long as they contribute. To participate in an IPSR TWG or PEG please contact the chair. The eight IPSR Technology Working Groups (TWGs) and three Product Emulator Groups (PEGs) are:

Download the latest version of the IPSR.

 

Technology Working Groups (TWGs)

 

Electronic-Photonic Assembly TWG
Chair: Dick Otte, Promex Industries
Co-chairs: Yi Qian, MRSI Systems, and Paul van Dijk, LioniX International

  • Design for manufacturing
  • Assembly
  • Supply chain trade-offs


Electronic-Photonic Connectors TWG

Chair: John MacWilliams, US Competitiors 

  • All separable interfaces within the system scope


Electronic-Photonic Design Automation TWG

Twan Korthorst, Synopsis

  • Integrated system simulation and design tools

 

Electronic-Photonic Interconnect TWG
Chair: Terry Smith, 3M
Peter Maat, Astron

 


Electronic-Photonic Packaging TWG

Chair: Bill Bottoms, Third Millennium Test Solutions (3MTS) 
Co-chair: Peter O'Brien, Tyndall National Institute

  • Cost, materials, heat, footprint, port count, bandwidth, integration, functionality


Electronic-Photonic Test TWG

Chair: Dave Armstrong, Advantest
Co-chairs: Tom Brown, AIM Photonics, and Sylwester Latkowski, Eindhoven University

  • Photonic and electrical test at all levels
     

Indium Phosphide & 3-5 Compounds TWG
Chair: Meint Smit, Eindhoven University of Technology
Co-chair: Kevin Williams, Eindhoven University of Technology

 

Integrated Photonic Sensors TWG
Co-Chairs: Ben Miller, University of Rochester; Anu Agarwal, MIT

  • Photonic sensors for a wide range of markets

 

Monolithic Silicon Integration TWG
Chair: Lionel Kimerling, MIT
Co-chair: Ajey Jacob, Global Foundries    

  • Chips: silicon photonics, InP
  • Design for manufacturing
  • Trade-offs for cost, bandwidth density, power efficiency and functional latency

 

Product Emulator Groups (PEGs)


Automotive PEG

Chair: Robert Pfahl, iNEMI

  • Identifies those automotive application needs that may be met most successfully with integrated photonics
  • Considers: Advanced Driver Assistance Systems (ADAS), Optical Local Area Networks (OLAN) and sensors for a wide range of applications
     

Cost Emulators / Modeling PEG
Co-chairs: Randolph Kirchain and Elsa Olivetti, MIT

  • Optical transceiver cost model
  • Analysis of the packaging of optical devices into a module
     

Data Center PEG
Chair: Robert Pfahl, iNEMI

  • High bandwidth, low latency, efficient power
  • Electronic to optoelectronic, and Optoelectronic to Electronic
  • Applications focus  on IT and Data Communications
     

Internet of Things (IoT) PEG
Chair: Richard Grzybowski, Photonic Controls    

  • Low bandwidth, “High” latency, low power
  • Primarily electronic to optoelectronic
  • Applications include IoT, military sensors
     

RF Photonics PEG
Chair: Arthur Paolella, Harris    

  • Covers the integrated electronic-photonic technology applications identified by AIM Photonics as important to meet high-speed analog communication needs over optical fiber links.