Monolithic Integration TWG

This TWG will cover chip-level integration on the Si and InP platforms, design for manufacturing, and trade-offs for cost, bandwidth density, power efficiency and functional latency. The long-term view will include identifying functional optical components such as optical switching

Dr. Lionel Kimerling
Lionel C. Kimerling
Director of AIM Photonics Academy and Chair, Monolithic Integration TWG