Electronic-Photonic Packaging TWG

This TWG covers packaging technology and cost objectives needed to meet market requirements for low-cost, high-volume photonic components and sub-systems for integration into the global network. Cost and performance objectives for system-level, board-level, package-level and, where it is practical, chip-level integration of photonics is the initial step. The needs for cost, materials, thermal, footprint, port count and bandwidth will be developed.

Wilmer (Bill) R. Bottoms
Chair, Electronic-Photonic Packaging TWG