Test TWG

The IPSR Test TWG addresses Overall lifetime test issues resulting from the inclusion of photonic capabilities into devices and products.  The emphasis is on CMOS silicon wafers and die with photonic functionality.  System-in-package (SiP) assemblies and systems are also addressed to the extent viable given the diversity of test needs that are specific to applications. The test issues for wafers, die, SiPs and systems will be addressed at the design, qualification, validation, production and in use stages of product life cycles.  Current and anticipated optical parameters to be tested and their value or level are considered along with the test access issue at each stage of the product life cycle. 

 
Richard (Dick) Otte
Chair, Assembly TWG; Acting Chair, Test TWG