Substrates TWG

The Substrates TWG covers all flexible and rigid electronic-photonic substrates in an integrated photonic system outside of the electronic-photonic package.  The needs for cost, materials, bandwidth and the timing for introduction into prototype and high-volume manufacturing will be developed. As a critical component of the interconnect system optimization, the TWG evaluates crosscutting issues with the Packaging, Assembly, Connectors, and Test TWGs.  


Voya Markovich
Chair, Substrates TWG