Substrates TWG

The Substrates TWG covers all flexible and rigid electronic-photonic substrates in an integrated photonic system outside of the electronic-photonic package.  The needs for cost, materials, bandwidth and the timing for introduction into prototype and high-volume manufacturing will be developed. As a critical component of the interconnect system optimization, the TWG evaluates crosscutting issues with the Packaging, Assembly, Connectors, and Test TWGs.  

To participate in this TWG, please contact Voya Markovich, Chair.

Voya Markovich
Chair, Substrates TWG