Packaging of Electronic-Photonic Systems TWG

This TWG covers packaging technology and cost objectives needed to meet market requirements for low-cost, high-volume photonic components and sub-systems for integration into the global network. Cost and performance objectives for system-level, board-level, package-level and, where it is practical, chip-level integration of photonics is the initial step. The needs for cost, materials, thermal, footprint, port count and bandwidth will be developed.

To participate in this TWG, please contact Bill Bottoms, Chair.

Wilmer (Bill) R. Bottoms
Chair, Packaging of Electronic Photonic Systems TWG