Monolithic Integration TWG

This TWG will cover chip-level integration on the Si and InP platforms, design for manufacturing, and trade-offs for cost, bandwidth density, power efficiency and functional latency. The long-term view will include identifying functional optical components such as optical switching

To participate in this TWG please contact Lionel Kimerling, Chair

Dr. Lionel Kimerling
Lionel C. Kimerling
Director of AIM Photonics Academy and Chair, Monolithic Integration TWG