Voya Markovich, TWG Leader

Voya Markovich chairs the Substrates TWG for the IPSR.

He is currently President of Microelectronic Advanced Hardware Consulting, LLC. From 2002 to 2012 he was Senior Vice President and Chief Technology Officer at Endicott Interconnect Technologies, Inc. (Endicott, NY).  Prior to that, Voya held several senior level positions with IBM.  From 1981 to 2002 his responsibilities included Manager, responsible for the IBM World Wide Organic Packaging Processes, Materials, and Assembly, and Senior Technical Staff Member.  He was a member of the elite IBM Academy of Technology.

Voya’s educational background includes a Masters of Science Degree in Chemistry from the Polytechnic Institute of New York and a Bachelor of Science degree from the University of Belgrade, and he received Honorary Doctoral Degree in Science from Binghamton University.  He is a member of the Interconnect Committee for ECTC, the American Chemical Society, IEEE/CPMT, SMTA, IMPAS, IPC, and First Past President of IMAPS.

Voya Markovich currently holds 256 U.S. patents and approximately 160 filed applications. He has authored more than 50 technical papers and a book chapter. 

 
Chair, Substrates TWG
Microelectronic Advanced Hardware Consulting