Board-Level Interconnect Project (proposed)
The Board-Level Optical Interconnect Project is proposed to build and test demonstration prototypes of board-level interconnect systems based on single-mode (SM) fiber, expanded-beam optical coupling, and silicon photonics transceivers. This activity will allow evaluation of existing and developing components, and thereby identify gaps in the technologies needed for practical implementation. These gaps, once identified, can be addressed via subsequent AIM or industrial programs.
On-Board Optical Interconnection: A Joint Development Project Consortium, Terry Smith (3M) and John MacWilliams (U.S. Competitors), presentation from AIM Photonics 2015 Fall Meeting (October 31-November 2; Cambridge, Massachussetts)